Vicor’s ChiP Platform provides a dramatic improvement in thermal management, allowing cooling through both the top and bottom sides of the package, as well as through the leads. The thermal performance of this new packaging technology helps power system designers keep pace with the demands to increase power density at a greater rate than improvements in converter efficiency. This white paper describes a model of the thermal performance of the ChiP platform and looks at the range of online design tools available to help designers optimize the thermal performance of their systems.