LSI Logic uses proprietary chip packaging tools for ASIC and Platform ASIC designs. This paper describes the use of OpenAccess as the centralized database model in the development of LSI Logic’s chip packaging tool referred to as Bond.

The OpenAccess (OA) database structure is discussed in reference to its modular approach to tool development.

Owing to specific requirements in the area of packaging, it has been necessary to leverage its various database extension mechanisms. Examples and experiences of using these extensions are presented.

Finally, a key requirement has been to offer application specific fexibility in the area of packaging. OpenAccess features which enabled this nature of flexibility are detailed.