Novel Thermally Enhanced Power Package
Heat generated in microelectronic devices as a result of dissipated power is a major issue in power electronics applications resulting in elevated application PC board temperatures. In order to minimize the down ward heat transfer to the application board an efficient method enabling the upward flow of heat from the silicon die to the top of the microelectronic package and subsequently transferred to the environment via forced convection needs to be employed. The problem is that most of the current packaging technologies have a very poor junction-to-top thermal resistance so it is very difficult to have a substantial portion of the heat flowing to the top of the device.
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