Nitronex performs 100% burn-in of packaged devices to remove most of the shift of VT and IMAX over the device’s lifetime. Due to the difficultly of consistently burning-in devices in wafer form, die do not receive this test. Sensitivity to shift of these parameters in a given application determines whether burn-in of die product is required by the customer. This application note describes the burn-in process, its effects, and how customers can perform burn-in if needed.