Semiconductor device reliability can generally be broken into two parts: infant mortality failures and wearout mechanisms. Infant mortality failures are due to manufacturing defects. The sources of these defects are generally the same as those that cause yield loss, so instrumentation requirements for detecting both are similar.

This paper addresses some of the new processes/materials likely to be introduced into the semiconductor process soon and discusses the impact of these changes on the process monitoring instrumentation required to ensure product reliability.

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