Teflon (PTFE) microwave laminates are increasingly being used in both RF and digital designs. Higher frequencies and data rates require material with a very low electrical loss, consistent dielectric constant, and tight thickness tolerance. PTFE laminates have all of these characteristics and offer superior performance in many applications. Board designers are continually looking for ways to save weight and space in their applications and are moving toward higher count multilayer designs to solve these issues. This white paper will review the different types of applications, bonding films and prepregs, equipment needs, and bonding methods that can be used to produce low and high count PTFE multilayer boards.