As our world becomes more reliant on increasingly complex electronic devices, the ability to monitor and optimize their safety, reliability and performance becomes essential.

This paper outlines a new approach to performance monitoring and optimization of advanced electronics based on multi-layer deep data. This new approach addresses key semiconductor industry pain points including design sensitivities, software and hardware bugs, device early-failure and wear-out, functional safety, and malicious attacks. Combining functional and parametric monitoring of real-world behavior of complex SoCs offers radical improvements in time-to-revenue and product quality and safety, while increasing reliability and enabling predictive maintenance strategies that can prevent field failures.