Windows Embedded Compact 7, the newest version of Windows Embedded Compact offering, provides a number of new features that make it an appealing choice when creating an end product. No matter what the project is, it is always beneficial to leverage the hard work you’ve already done. Combining the power and features of Compact 7 with the OMAP 3 processor and the AM37x Sitara ARM microprocessors (MPUs) offerings from Texas Instruments means that you can build powerful devices leveraging the ARM Cortex-A8 cores. This paper highlights the tasks, challenges, and benefits when porting an existing board support package (BSP) from Windows Embedded CE 6 (CE 6) to Windows Embedded Compact 7 (Compact 7).