Applications requiring ultra high placement accuracies of 1um to 3um are resurfacing in several optoelectronic applications such as Arrayed Laser Print Head assemblies, P-Side Down Laser Attachment applications, and Multi-Channel Optical Communication products. An overview of the technologies, placement accuracies, and attachment methods is presented for two cases. With placement accuracies for surface mount machines typically around 40µm, 10µm for die attach machines, and 1µm for ultra high accuracy placement machines, this paper will cover the differences in measurement, material, and process controls that are required to successfully achieve ultra high placement accuracies of 3µm.