The following paper provides Via Fanout and Trace Routing solutions for various metric pitch Ball Grid Array Packages. Note: the “metric” dimensions are the ruling numbers. To solve the metric pitch BGA dilemma, one should have a basic understanding of the metric feature sizes for: BGA Ball Sizes and BGA Land Pattern Pad Construction, BGA Via Anatomy, Trace/Space, Trace and Via Routing Grid, Differential Pairs and HDI Hole Size/Annular Ring.

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