Introduction to Via-In-Pad Board Design
Plated Through-hole Via-In-Pad (VIP) board design is a proven technique that drives forcost competitive board development, improved signal quality, robust yield, and equivalent PCB/Packaging reliability. It is an alternative technique to consider when starting a new board design. This paper will focus on what VIP is and its trade-offs versus other design techniques.
Please disable any pop-up blockers for proper viewing of this Whitepaper.