The microelectronics package can be thought of as a system of materials serving to both protect an integrated circuit (IC) from the elements of its operating environment and to interconnect (electrically, electromagnetically, optically, and so forth) an IC to the operating system. Often, the package links finer geometries to coarser geometries as the nanometer realm of the semiconductor communicates with the millimeter and larger world of the application system. A package can range from a complex multilayer substrate containing hundreds of components to a single chip directly attached to the system board. Throughout the range of methods used to interconnect an IC to the rest of the system circuit, the interdisciplinary technology of packaging is applied. The purpose of this book is to introduce the reader to the various packaging technologies in the IC industry and share from the extensive reliability engineering experience of the authors from Agere Systems.

Reproduced from the book Failure-Free Integrated Circuit Packages. Copyright 2004 The McGraw-Hill Companies. Reproduced by permission of The McGraw-Hill Companies. Written permission from The McGraw-Hill Companies is required for all other uses.