This paper details the application of thermal characterization test methods to four medium power IGBT modules containing two half bridges, demonstrating results showing degradation of the thermal structure in conjunction with power cycling of the components. This paper will explain:

  • Background and set up experiments to illustrate different failure modes
  • How different powering strategies, can represent different operating conditions
  • The ability to pinpoint and quantify degradation in the thermal stack during development
  • How to predict lifetime of parts by automating power cycling with real time material structure analysis of the heat flow path