As BGA pin pitches continue to shrink, from 1.0mm to .8mm and below, designers must strategize how they will implement their projects. Designs that are driven by sub-millimeter BGAs demand specific methodologies and are usually classed as some of the toughest design challenges today, due to their physical layout constraints. When a decision is made to use sub-millimeter BGAs on a design, microvia technology may be chosen to complement the strategy. Advanced planning is essential to determine how the via strategy should behave during the route process. Neglecting the planning phase can cost precious time during the design and routing if the strategy was not given thorough consideration as to its accuracy.