Sensor-based designs, such as IoT systems, combine many design domains implemented on CMOS. These systems can be implemented on multiple dies and could employ multiple packages. To accommodate multiple sensor types, a traditional CMOS IC flow must be extended to include MEMS and photonics elements along with analog and digital elements. If the system communicates with the Cloud, an RF element is also necessary. Multi-domain design requires that analog, digital, RF, photonics, and MEMS elements are designed and work together within the system. Teams need to capture each element of the design, perform layout and verification.

This paper covers a solution for an integrated, top-down design flow for IoT design that supports the five design domains.