Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below 0.4 mm pitch) and high pin counts (over 2000). When these packages assembled onto a printed circuit board (PCB), they perform certain functions at certain speed. Socketing is one of the avenues to mount IC packages to PCB semi permanently. Socketing these high-speed and high-density IC packages requires an innovative solution to the challenges of designing a socket with shorter signal path (less resistance), good electrical insulation (prevents signal loss), and proper thermal management.