In our mobile computing era, system-on-chip (SoC) design has become much more complex, with challenges from complex design rules on advanced process nodes, low-power circuitry design techniques, and increasing circuit sizes. Power integrity is a crucial part of successful design signoff. This paper discusses a new tool that speeds power integrity analysis and signoff by 10X compared to other technology available, while still providing SPICE-like accuracy. The tool integrates with a full suite of design implementation and signoff tools, together overcoming signoff challenges to deliver the industry’s fastest design closure flow.