For die packaging, the information required from the die side is received in the form of I/O bond and probe site data which contains the bond and the probe locations for all the I/O pads inside the die. Any incorrect information renders the substrate design useless. Any probe/bond location information inside a lower hierarchy within an I/O pad can be easily missed using the conventional approaches. This paper discusses an approach which is hierarchy independent and provides a fool proof way of generating the bond-site and probe-site information for handshaking with packaging.