Today’s power MOSFET technology must be able to handle more power and to run cooler in applications to meet evolving industry needs. ON Semiconductor’s new Thermally Enhanced (TE) SO8−FL provides lower thermal resistance through the top of the package to deliver improved thermal performance, efficiency, reliability and power-carrying capability. The SO8−FL TE devices have the same footprint and pin-out as the standard 5×6 mm SO8−FL package for fast translation into practical applications, allowing for ease of design-in and manufacturing.