High-density interconnect (HDI) fabrication is the fastest growing segment of the printed circuit industry — HDI/microvia technologies are the printed circuit board (PCB) architectures of the future. Smaller component pitches, larger application specific integrated circuits (ASICS) and field programmable gate arrays (FPGAs) with more I/O, embedded passives, and higher frequencies with shrinking rise-times all require smaller PCB features, driving the need for HDI/microvia.


This paper outlines the six simple processes in PCB fabrication that have to be improved in order to successfully build highly reliable HDI/microvia boards. The paper’s conclusion emphasizes the business opportunities and challenges faced by management in starting and developing an HDI fabrication business.

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