Because dynamic random-access memory (DRAM) has become a commodity product, suppliers are challenged to continue producing these chips in increasingly high volumes while meeting extreme price sensitivities. It’s no easy feat, considering the ongoing demands for increased bandwidth, low power consumption, and small footprints from a variety of applications. This white paper takes a look at five next-generation DRAM technologies—LPDDR3, LPDDR4, Wide I/O 2, HBM, and HMC—that address these challenges.