Fanless Cooling for Embedded Applications
Embedded market opportunities for Intel architecture components exist in Point-Of-Sale Terminals, Digital Signage, and Digital Security Surveillance market segments to name a few. When selecting Intel architecture, several key metrics customers pay attention to include performance/watt, Thermal Design Power (TDP), total cost of ownership, and reliability. The Embedded Computing Group (ECG) offers scalability with Intel architecture products ranging from full power (35W and up) to low power (10W~15W) to ultra low power (~5W) Intel architecture system solutions to address these market segments and requirements. The objective of this white paper is to provide system designers a reference fanless cooling solution for a Point-Of-Sale application.
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