Currently, the mobile devices use the Wafer Fabricated Package (WFP) package solution for PMIC, RFIC because of its low cost and compact package size. However, the limited ball count prevented WFP from spreading in lots of small die size ICs so that the conventional plastic package solutions like Wire Bonding (WB) or Flip Chip (FC) FBGA still have been adopted for mobile devices. Therefore, as the intermediate package solution, Fan-out Wafer Fabricated Package (FOWFP) needs to be developed to satisfy the requirement for the lower cost and smaller size mobile packaging solution for low pin count and small die size IC, compared to the conventional plastic packages.