The 22nm node will be patterned with very challenging Resolution Enhancement Techniques (RETs) such as double exposure or double patterning. Even with those extreme RETs, the k1 factor is expected to be roughly 0.29. The authors will compare traditional OPC techniques with so-called extreme OPC. Extreme OPC has the advantage that it can produce unconstrained and non-intuitive mask shapes. The comparison will be performed using expected 22nm RETs like double exposure and double patterning.

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