Examples of Physical and Scalable SPICE Models for Modern Power Electronic Devices
Efficient power electronic design hinges on the availability of accurate and predictive SPICE models. This paper proposes novel physical and scalable SPICE models for power electronic semiconductors including wide-bandgap devices. The models are based on process and layout parameters, enabling design optimization through a direct link between SPICE, physical design, and process technology. The models are used as key design components during technology development and for the proliferation of new products.
Please disable any pop-up blockers for proper viewing of this Whitepaper.