The two packaging processes most prevalent in IC industry are the Wirebond packaging and the Flip-Chip Packaging. Wirebond packaging and Flip-Chip packaging are logically inverted packaging techniques, as far as die design is concerned. Hence a die layout designed for Wirebond packaging cannot be used as-is for Flip-Chip packaging technology and vice versa. A switch of packaging option for a die from Wirebond to Flip-Chip or vice versa requires that the die be reworked from scratch to address the mirror image constraints. This paper discusses a technique which enables the die compatibility between these two packaging technologies without making any changes to the board or the die layout.