If an embedded system consists of more than a chip or a few chips on an electronics board, it requires an enclosure to hold the parts together. Additional components inside an enclosure include a power supply to provide electrical power, a fan to cool the parts and a backplane to hold and interconnect the boards. A set of circuit boards and a suitable backplane to interconnect them housed in a standardized box or subrack might comprise a CompatPCI or VMEbus system. Standards for ‘electronic packaging’ of such embedded systems come from ANSI, ANSI/IEEE, ANSI/VITA, ISO/IEC and industrial associations like PICMG or PCI SIG. This paper presents applicable standards and information for electronic packaging, with consideration given to environmental conditions, such as temperature, shock, vibration, EMI, ESD, RFI, and safety.