Not long ago I had a conversation with a thermal engineer who was using a phase change pad as the thermal interface material (TIM) in a certain device. Some of the devices failed pre-maturely due to overheating. The engineer felt this problem could be solved by using higher performance TIM like a thermal compound (or grease) from Dow Corning, but was afraid to change to a grease because he thought that using a grease for field rework would be too challenging for the his technicians. The focus of this paper is to show that thermal greases are the clear thermal interface of choice for network applications.