As new higher bandwidth data transfer algorithms and conventions are developed, along with supporting IC ASIC architecture infrastructure, a need emerges to transition these improvements into mass market technology embodiments. Additionally, as new generations of PC systems migrate into the microwave arena, demand for increased bandwidth I/O interfaces becomes paramount. Scaling of the Universal Serial Bus Standard, due to its unquestioned prolific hardware & software support infrastructure success, presents an additional design challenge of legacy compatibility with established past physical connector profiles and logical software protocol conventions.

This paper illustrates key novel design constructs developed to address next generation Universal Serial Bus, or USB 3.0 SuperSpeed interconnect requirements in a manner offering a cost-effective, reliable extensions with increased bandwidth of 5Gb/s per differential channel.