Design Characteristics of High Performance and Reduced Cost Chip Scale Package—µBGA
The major trend in electronic products today is to make them lighter, smaller, thinner, and faster, while at the same time more reliable, powerful, and cheaper package is expected. A well-known Tessera BGA is the only CSP package that pass JEDEC level 1 qualification for high performance Rambus, DDR and Flash products. Adding extra thin core rigid board with hard spring copper instead of TAB tape would provide better ground shielding and dimensional stability. Thus we have to discuss the thermal performance while applying the new substrate.
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