The field of component-level thermal design has taken a giant step forward with the release of the DELPHI compact model capability by a leading software vendor. This study shows how Delphi compact models are the method of choice for predicting the performance of IC packages in realistic electronics cooling environments. Although two-resistor models are useful in some design situations, the thermal community is already switching to the use of Delphi compact models due to their greatly superior performance and computational efficiency.

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