Visibility of HBM subsystems is limited by nature due to its 3D integration technology, and signal integrity problems are difficult to debug, validate and monitor. Multi-die HBM packaging introduces new reliability challenges which can lead to functional device failures in-field. In addition, an HBM PHY does not allow for redundancies due to the high-density routing, and one u-bump per signal is used for the entire HBM connectivity. In this case, a failure in any of the PHY or HBM u-bumps will lead to a chip operational failure.

This whitepaper presents the use of proteanTecs Deep Data analytics for HBM reliability monitoring. It describes the operation concept and provides results from a GUC 7nm HBM Controller ASIC.