Cracking the 'WIP Effect' for Maximum Material Performance
Productivity reports from electronics manufacturing of PCB assemblies consistently show that the number one cause of down-time on SMT lines is related to material, as either a shortage or a logistical misstep that fails to place the right quantity of the right material at the right location at the right time. From a business perspective, the downtime caused by material problems is the largest cost in the operation. This downtime often snowballs into missed delivery schedules, significant reductions in asset utilization and—most costly of all—it creates pressure to invest in more materials as a buffer against “perceived” shortages.
Please disable any pop-up blockers for proper viewing of this Whitepaper.