This paper serves as a general introduction to conductive adhesives and explains an alternate method of SMT (Surface Mount Technology) attachment – Conductive Epoxy attachment. It explains the pros and cons of epoxy attachment and its advantages over traditional (solder) attachment for ceramic and MLO (multilayer organic) capacitors.

SMT technology is evolving rapidly within the passive component world, so a review of significant trends and developments is included (miniature case sizes, FlexiTerm termination, MLO technology).