CFD System Level Modeling of a Large Telecommunications Enclosure
The growing demand for DSL service by residential users has created a new breed of telecommunications equipment and enclosures. These new enclosures are intended to replace the old style “green box” and bring people and access into the 21st century. This is accomplished using much of the existing infrastructure making it easier for service providers to catch up with the soaring demand for broadband access. This paper covers a system level analysis of a large telecommunications enclosure. It describes the methodology in creating compact models from detailed models and the approach used to model compact heat exchangers used in the enclosure. The model is validated against thermal tests and additional modeling reveals potential cost reductions in the design. The end result is a model that can predict with confidence multiple configurations of equipment inside a large enclosure. This tool allows for significant cost savings in both development and production. The development savings are realized by not having to physically build and test multiple configurations and the production savings are realized from cost reductions in the design.
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