This paper examines the extendibility of scatterometry techniques to characterize structures that are close to limits of lithographic printing and to extract full profile information for 2D and 3D features for OPC model calibration. The resist LER concerns are diminished because of the automatic averaging that scatterometry provides over the measurement pad; this represents a significant added value for proper OPC model calibration and verification. This work develops a comparison matrix to determine the impact of scatterometry data on OPC model calibration with conventional CD-SEM measurements. The paper will report test results for the OPC model through process data for accuracy and predictability.

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