For many products designed with today’s high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production phases of a new product development process. In response to these demanding needs, sockets featuring a wide variety of contacting methods, form factors, and mounting techniques have been developed. Socketing systems now exist that perform at bandwidths exceeding 10 GHz and with ball pitch spacing down to 0.5mm. As BGA devices with finer pitch, larger I/O counts, and increased gate densities are utilized, the requirements for sockets continue to increase accordingly.