High-speed sockets and adapters continue to perform important functions for today’s IC component and electronics packaging engineers. Whether for testing, prototyping, or production, these components typically require an ever-increasing level of electrical and mechanical performance. In the area of electrical performance it is particularly important that an accurate predictive model be available for performance at GHz frequencies. Rather than relying solely upon historical measures derived from complex test configurations, these predictive models as simulations are capable of providing accurate performance data in a timely as well as cost-effective manner. This data then serves as an aid to the design and test engineer relative to the initial selection of a proper interconnect design, and also serve as a predictor of performance over a variety of simulated end-use conditions. Since a beneficial simulation technique must be both reliable and versatile, the goal of this paper is to demonstrate this utility across a wide range of interconnect product designs.