Benefits of Migrating to Wafer-Level Chip-Scale Packaging
With the average consumer’s demands for portable gadgets that offer an abundance of enhanced features in the most compact shell, OEMs and their ODM and contract manufacturing counterparts are faced with the dilemma of shrinking board space. Integration seems to be the “easy” answer, but cost becomes the barrier. So begins the quest to uncover the smallest, highest-quality, top-performing package option available that matches manufacturing capabilities.
Luckily, many semiconductor suppliers have been investing in the development of such enhanced package options. One such option is the wafer chip-scale package (WCSP). The advantages of the WCSP, compared to conventional lead-frame packages, as well as the latest land grid array (LGA), provide electronics manufacturers and their partners with what they need to win in their respective marketplace and meet today’s consumer demands.
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