Packaging has always significantly impacted on microwave IC and amplifier performance. In most cases, the inherent parasitic capacitance and inductance of the package lead frame and wire bonds set a limit to circuit performance. Avago Technologies developed a bonded-wafer-to-wafer package technology in 2004 and now offers innovative microwave gallium arsenide (GaAs) VMMK devices based on the proprietary WaferCAP chip scale package. Surfacemount (SMT), very low cost VMMK amplifier and FET devices are available today and soon to be released diodes and detectors will be added to the VMMK series.