Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-Scale Packaging Technology
Smaller, lower-cost components are crucial to the development of today’s higher-performance, smaller, and increasingly price-competitive mobile devices. Since the introduction of chip scale packages (CSPs) they have become a major trend in active device packaging. Chip scale packaging combines the size and performance advantage of bare die assembly and the reliability of encapsulated devices, while permitting automated assembly processes and low production costs. This paper describes chip-scale packaging in depth and introduces Avago’s Advanced Wafer-scale Packaging Technology.
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