Tin/Lead – “solder” – has served as the primary bonding and conducting agent for electrical interconnection of wires and components in electronic and electrical equipment for decades. However, lead has been determined to be a hazardous substance and the use of tin/lead solders are being restricted by government laws and regulations such as the European Union’s RoHS Directive (Restriction of Hazardous Substances).

Alternate solder alloys such as “Tin/Copper/Nickel” ” “Tin/Copper” ” “Tin/Copper/Silver”, and “Tin/Silver” are available as potential replacements for Tin/Lead. Although the Tin/Lead solder technology has been well documented for it’s reliability, durability, and maintainability, the Lead-Free solder alloys are not equivalent “drop in” replacements.