Assembling High-Lead (Pb) DS2761 Flip-Chips in a Pb-Free Assembly Flow
Usage of lead (Pb) in electrical and electronic components was recently prohibited by the European Union through the Restriction of Hazardous Substances Directive (RoHS). Assembly processes must therefore become lead-free (Pb-free). Although the DS2761 flip-chip die are exempt from the RoHS regulations, they have been successfully assembled in a Pb-free reflow process. This application note details the Pb-free assembly process used, and the reliability stresses encountered after the assembly.
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