Usage of lead (Pb) in electrical and electronic components was recently prohibited by the European Union through the Restriction of Hazardous Substances Directive (RoHS). Assembly processes must therefore become lead-free (Pb-free). Although the DS2761 flip-chip die are exempt from the RoHS regulations, they have been successfully assembled in a Pb-free reflow process. This application note details the Pb-free assembly process used, and the reliability stresses encountered after the assembly.