Ball grid arrays (BGAs) leave a considerably smaller footprint on the PCB and induces better thermal and electrical properties than a perimeter-style mounting package. Their unparalleled pin density and low lead inductance are essential in today’s high pin count, high frequency integrated circuits. So it’s no surprise their popularity has grown in tandem with the continuous miniaturization of electronics. However, that same pin density and unique interface create unique challenges. This quick overview provides a good starting point for using BGAs in designs.