3D Model to Analyse the Thermal Behaviour of a Digital Rectifier
The continuing substitution of analog by digital module in medium and large size telecommunication systems, have been contributing to elevate the importance of studying the thermal behavior in these equipments, in which it is well acknowledged the occurrence of large amount of energy being dissipated in small areas (electronic components). In such class of systems, one can observe convection transport driven by density gradients and/or by forced ventilation. The aim of this study is to investigate the thermal comportment of a digital rectifier located inside a telecom cabinet. A 3D numerical model, based on computational fluid dynamics, was constructed to represent the whole package. For the sake of model simplicity, during the modeling procedure it was considered the components that have the most representative size and power dissipation. Results concerning to several rectifier configurations (such as changes in components arrangement and ventilation entrance/exhaust) are presented in order to identify deficient ventilation and high temperature regions.
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