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Choosing Inductors for Energy Efficient Power Applications
Technical Paper
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Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages
by ANSYS
Technical Paper
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Connectivity for Next-Generation Mobility
Technical Paper / Product Paper
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Accelerating DO-254 Approval with Cadence Tools
Technical Paper
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Translating Verilog Simulation Data to Device Test Programs
by Source III
Technical Paper
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Optimizing DDR Memory Subsystem Efficiency Part 2: A Mobile Application Processor Case Study
by Synopsys
Technical Paper
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New Approach to FastSPICE Simulation Technology Eliminates Performance Bottlenecks
Technical Paper
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Choosing Inductors for Energy Efficient Power Applications
Technical Paper
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Using Simulation-based Approach to Ensure Power Integrity and Reliability of SoC and System
by ANSYS
Technical Paper
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Addressing the "Power-Aware" Challenges of Memory Interface Designs
Technical Paper
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Localized, System-Level Protocol Checks and Coverage Closure
Technical Paper
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Correlating Measurement and Simulation: Analysis Anchored to Reality
Technical Paper
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Physical Design Reuse in PADS: How to Leverage Corporate IP to Increase Efficiency in PCB Design
Technical Paper
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Autonomous Vehicle Radar: Improving Radar Performance with Simulation
by ANSYS
Technical Paper
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Wireless Connectivity Testing Challenges for Consumer Electronics Devices
by Novus Labs
Technical Paper
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Examples of Physical and Scalable SPICE Models for Modern Power Electronic Devices
Technical Paper
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