Thick-film technology makes it possible to print circuits directly onto heat sinks

A new technique developed by TT Electronics IRC Advanced Film Division makes it possible to produce custom thick-film circuits and assemblies that allow high current-carrying traces (up to 100 amps) to be printed directly onto ceramic substrates for power hybrids or solid-state relay substrates. The new technique is said to provide design engineers with high power circuits and assemblies at lower costs than typical direct-bonded copper methods.