Sharp develops 3D-SiP with 0.5-mm ball pitch

Sharp Corp. has developed a 0.5-mm ball pitch technology for 3D systems-in-package (3D-SiP). The company is able to stack a digital signal processor, flash memory, and synchronous DRAM chips in a a stack with a 14-mm by 14-mm plan dimensions and 1.7-mm in height. Initial applications for the packaging system are digital cameras, Sharp said.