Quickly and easily Socket your 1mm pitch, 31x31mm BGA package on any PCB without significant performance loss

EAGAN, MN – December, 2014 – Ironwood Electronics has recently introduced a new high performance BGA socket for Hybrid Memory Cube (1mm pitch, 900 pin BGA). A hybrid memory cube (HMC) is a single package containing either four or eight DRAM die and one logic die, all stacked together using throughsilicon via (TSV) technology.