Multichip module broadens its DC/DC horizons

Irvine, Calif. – Addressing the demand for higher current and higher frequency power solutions for DC/DC converters, Toshiba America’s TB7001FL multichip module (MCM) combines a driver IC with a MOSFET and the company’s MOSBD, a single-die combination of a power MOSFET and a Schottky barrier diode, in one package measuring just 8-by-8-by-0.85 mm. The new MCM represents a level of integration beyond the company’s dual-channel MOSBD product, which combines a high-side MOSFET with a low-side MOSFET/Schottky barrier diode.